Surface Mount Technology with Fine Pitch Components: The manufacturing issues

by H. Danielsson

Overview

This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.

Product Details

ISBN-13:	9780412553400
Publisher:	Springer US
Publication date:	11/30/1994
Edition description:	1994
Pages:	242
Product dimensions:	6.10(w) x 9.25(h) x 0.02(d)
Age Range:	18 Years

Table of Contents

Foreword. Introduction. Economic aspects of manufacturing. Driving forces in electronics. Basic properties of solder materials. Printing of solder pastes for fine pitch components. The printing process. The soldering process. Parameters influencing soldering results. Optimization of soldering results. Design related manufacturing problems. Manufacturing problems specific to fine pitch components. Soldering process influence on component reliability. Limitations of current surface mounting technology and new packages types. Future manufacturing technologies.

Editorial Reviews

A guide to problems and solutions around the continuing miniaturization that is making component lead pitches ever finer in surface-mount electronics manufacturing. Production issues are the central concern, but design characteristics, process and quality are also recognized as essential elements. Some of the topics are the basic properties of solder material, the printing and soldering processes, optimizing soldering results, the influence of soldering on component reliability, limitations of current technologies, and technologies on the horizon. Addressed to process engineers and production managers. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Booknews