Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Handbook of Electronic Package Design, Author: Michael Pecht
Title: Run-to-Run Control in Semiconductor Manufacturing, Author: James Moyne
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging / Edition 1, Author: Xing-Chang Wei
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong

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