Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Heat Transfer: Thermal Management of Electronics, Author: Younes Shabany
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Handbook of Electronic Package Design, Author: Michael Pecht
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
Title: Hermeticity of Electronic Packages, Author: Hal Greenhouse
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht

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