Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari

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