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Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
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Thermal Stress and Strain in…
by John Lau (Editor)
Paperback $169.99
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
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Thermal Design of Electronic…
by Ralph Remsburg
#6 in Series
eBook $240.00
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
Explore Series
Hardcover $218.95
Title: The Electronics Assembly Handbook, Author: Frank Riley
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The Electronics Assembly…
by Frank Riley (Editor), Electronic Packaging and Production (Editor)
Paperback $199.99
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell (Editor)
#4 in Series
Hardcover $300.00
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell (Editor)
Explore Series
eBook $300.00
Title: The Basics of Soldering, Author: Armin Rahn
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The Basics of Soldering
by Armin Rahn
Hardcover $312.95
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
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Soldering Processes and…
by Michael G. Pecht (Editor)
Hardcover $177.95
Title: Run-to-Run Control in Semiconductor Manufacturing, Author: James Moyne
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Run-to-Run Control in…
by James Moyne (Editor), Enrique del Castillo (Editor), Arnon M. Hurwitz (Editor)
eBook $230.00
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects, Author: Michael G. Pecht
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Quality Conformance and…
by Michael G. Pecht (Editor), Abhijit Dasgupta (Editor), John W. Evans (Editor), Jillian Y. Evans (Editor)
Paperback $188.95
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
eBook $64.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
Paperback $64.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
Hardcover $220.00
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling, Author: Yong Liu
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Power Electronic Packaging:…
by Yong Liu
Hardcover $279.99
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Paperback $169.99
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
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Hardcover $329.99
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
eBook $59.99
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
Paperback $59.99

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