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Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: The Basics of Soldering, Author: Armin Rahn
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The Basics of Soldering
by Armin Rahn
Hardcover $312.95
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
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Soldering Processes and…
by Michael G. Pecht (Editor)
Hardcover $177.95
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Chip On Board: Technology for Multichip Modules, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
Explore Series
Hardcover $219.99
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects, Author: Michael G. Pecht
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Quality Conformance and…
by Michael G. Pecht (Editor), Abhijit Dasgupta (Editor), John W. Evans (Editor), Jillian Y. Evans (Editor)
Paperback $188.95
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones (Editor), Karel Kurzweil (Editor), Gábor Harsányi (Editor), Sylvia Mergui (Editor)
#2 in Series
Hardcover $219.99
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
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Hardcover $218.95
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Explore Series
Hardcover $240.00
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
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CAE - CAD and Thermal…
by Dereje Agonafer (Editor)
Explore Series
Paperback $72.00
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael Pecht, Edward B. Hakim
Explore Series
Hardcover $150.00
Title: Failure Modes and Mechanisms in Electronic Packages, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Manufacturing Challenges in Electronic Packaging, Author: Y.C. Lee
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Manufacturing Challenges in…
by Y.C. Lee (Editor), W.T. Chen (Editor)
Hardcover $109.99
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
#4 in Series
Hardcover $210.00
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Hardcover $140.00

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