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Title: Advanced Wirebond Interconnection Technology, Author: Shankara K. Prasad
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Advanced Wirebond…
by Shankara K. Prasad
Other Format $329.99
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Paperback $279.99
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Hardcover $279.99
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
Explore Series
eBook $225.00
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
Explore Series
eBook $199.00

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