Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia

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