Title: PCB Design for Real-World EMI Control, Author: Bruce R. Archambeault
Title: High-Speed Circuit Board Signal Integrity, Author: Stephen C. Thierauf
Title: Advanced Routing of Electronic Modules, Author: Michael Pecht
Title: Integrated Passive Component Technology, Author: Richard K. Ulrich
Title: Cost Engineering in Printed Circuit Board Manufacturing, Author: R. P. Hedden
Title: Printed Resonant Periodic Structures and Their Applications, Author: Mahesh Abegaonkar
Title: EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple, Author: Mark I. Montrose
Title: The Boundary-Scan Handbook, Author: Kenneth P. Parker
Title: Boundary-Scan Test: A Practical Approach, Author: Harry Bleeker
Title: Structural Analysis of Printed Circuit Board Systems, Author: Peter A. Engel
Title: Handbook of Flexible Circuits, Author: Ken Gilleo
Title: Foldable Flex and Thinned Silicon Multichip Packaging Technology, Author: John W. Balde
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie S. Hwang
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
Title: The Boundary-Scan Handbook: Analog and Digital, Author: Kenneth P. Parker
Title: Analog and Mixed-Signal Boundary-Scan: A Guide to the IEEE 1149.4 Test Standard, Author: Adam Osseiran
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
Title: Placement and Routing of Electronic Modules, Author: Michael Pecht
Title: Printed Organic and Molecular Electronics, Author: Daniel R. Gamota
Title: Cleaning Printed Wiring Assemblies in Today's Environment, Author: L. Hymes

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