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Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
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The Basics of Soldering /…
by Armin Rahn
Hardcover $312.95
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: Soldering Processes and Equipment / Edition 1, Author: Michael G. Pecht
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Soldering Processes and…
by Michael G. Pecht
Hardcover $177.95
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
Explore Series
Hardcover $219.99
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones, Karel Kurzweil, Gïbor Harsïnyi, Sylvia Mergui
#2 in Series
Hardcover $219.99
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim, Sang Woo Lee
Hardcover $82.99
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
Explore Series
Hardcover $218.95
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
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High Temperature Electronics /…
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Explore Series
Hardcover $240.00
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
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Manufacturing Challenges in…
by Y.C. Lee, W.T. Chen
Hardcover $109.99
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
#4 in Series
Hardcover $210.00
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Hardcover $140.00
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
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Mechanical Analysis of…
by Stephen A. McKeown
#120 in Series
Hardcover $350.00
Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell
#4 in Series
Hardcover $300.00

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