ISBN-10:
0470623462
ISBN-13:
9780470623466
Pub. Date:
04/17/2012
Publisher:
Wiley
Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC / Edition 1

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC / Edition 1

by Er-Ping Li
Current price is , Original price is $127.0. You

Temporarily Out of Stock Online

Please check back later for updated availability.

Product Details

ISBN-13: 9780470623466
Publisher: Wiley
Publication date: 04/17/2012
Pages: 384
Product dimensions: 6.00(w) x 9.30(h) x 1.20(d)

About the Author

ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.

Read an Excerpt

Click to read or download

Table of Contents

Foreword xi

Preface xiii

1. Introduction 1

1.1 Introduction of Electronic Package Integration, 1

1.2 Review of Modeling Technologies, 6

1.3 Organization of the Book, 10

2. Macromodeling of Complex Interconnects in 3D Integration 16

2.1 Introduction, 16

2.2 Network Parameters: Impedance, Admittance, and Scattering Matrices, 19

2.3 Rational Function Approximation with Partial Fractions, 25

2.4 Vector Fitting (VF) Method, 29

2.5 Macromodel Synthesis, 41

2.6 Stability, Causality, and Passivity of Macromodel, 48

2.7 Macromodeling Applied to High-Speed Interconnects and Circuits, 79

2.8 Conclusion, 91

3. 2.5D Simulation Method for 3D Integrated Systems 97

3.1 Introduction, 97

3.2 Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems, 98

3.3 Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes, 127

3.4 Numerical Simulations for Finite Structures, 133

3.5 Modeling of 3D Electronic Package Structure, 142

3.6 Conclusion, 182

4. Hybrid Integral Equation Modeling Methods for 3D Integration 185

4.1 Introduction, 185

4.2 2D Integral Equation Equivalent Circuit (IEEC) Method, 186

4.3 3D Hybrid Integral Equation Method, 220

4.4 Conclusion, 238

5. Systematic Microwave Network Analysis for 3D Integrated Systems 241

5.1 Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair, 242

5.2 Parallel Plane Pair Model, 281

5.3 Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias, 305

6. Modeling of Through-Silicon Vias (TSV) in 3D Integration 331

6.1 Introduction, 331

6.2 Equivalent Circuit Model for TSV, 336

6.3 MOS Capacitance Effect of TSV, 351

6.4 Conclusion, 356

References, 358

Index 361

Customer Reviews

Most Helpful Customer Reviews

See All Customer Reviews