Embedded Mechatronic Systems: Analysis of Failures, Predictive Reliability

by Abdelkhalak El Hami (Editor), Philippe Pougnet (Editor)

Overview

Mechatronics brings together computer science, mechanics and electronics. It enables us to improve the performances of embedded electronic systems by reducing their weight, volume, energy consumption and cost. Mechatronic equipment must operate without failure throughout ever-increasing service lives.The particularly severe conditions of use of embedded mechatronics cause failure mechanisms which are the source of breakdowns. Until now, these failure phenomena have not been looked at with enough depth to be able to be controlled. - Provides a statistical approach to design optimization through reliability - Presents an experimental approach for the characterization of the development of mechatronic systems in operating mode - Analyzes new tools that effect thermal, vibratory, humidity, electric and electromagnetic stresses

Product Details

ISBN-13:	9780081019559
Publisher:	ISTE Press - Elsevier
Publication date:	11/26/2019
Sold by:	Barnes & Noble
Format:	eBook
Pages:	274
File size:	25 MB
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About the Author

Abdelkhalak El Hami is Professeur des universités at the Institut National des Sciences Appliquées (INSA-Rouen) in France and is in charge of the Normandy Conservatoire National des Arts et Metiers (CNAM) Chair of Mechanics and Head of the department of mechanical engineering of INSA Normandy, as well as several European pedagogical projects. He is an expert in fluid–structure interaction studies, reliability and optimization.

Table of Contents

1. Reliability-Based Design Optimization2. Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices3. Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities4. Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques5. Characterization of Switching Transistors under Electrical Overvoltage Stresses6. Reliability OF Radio Frequency Power Transistors to Electromagnetic and Thermal Stress7. Internal Temperature Measurement of Electronic Components8. Reliability Prediction of Embedded Electronic Systems: the FIDES Guide9. Study of the Dynamic Contact Between Deformable Solids

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From the Publisher

Illustrates new analytical tools and proposes two methodologies to highlight the evolution and optimization of these embedded mechatronic systems