Printed Circuits Handbook, Seventh Edition

by Clyde F. Coombs Jr., Happy Holden

Overview

The world's leading guide to printed circuits—completely updated to include the latest tools, technology, and techniques

The de facto industry-standard for over 30 years, this practical guide equips you with definitive coverage of every facet of printed circuit assemblies—from design methods to fabrication processes. Now thoroughly revised and updated, this book offers cutting-edge coverage of printed circuit engineering, fabrication, construction, soldering, testing, and repair.

Printed Circuits Handbook, Seventh Edition features all new, critical guidance on how to create, manage, and measure performance throughout the global supply chain. Written by a team of international experts from both industry and academia, this comprehensive volume offers new information on geographical specialization as well as the latest phase of the EUs Directive on the Restriction of Hazardous Substances (ROHS II).

• Fully overhauled to cover the latest scientific and technical developments
• Brand-new coverage of printed circuit supply chain technology and geographical specialization
• Complete explanations of new EU safety directives for halogen-free base materials

Product Details

ISBN-13:	9780071833967
Publisher:	McGraw Hill LLC
Publication date:	02/15/2016
Sold by:	Barnes & Noble
Format:	eBook
Pages:	1504
File size:	184 MB
Note:	This product may take a few minutes to download.

About the Author

Clyde Coombs joined Hewlett-Packard in 1959, where he developed the plated-through-hole process that became the basis for printed circuit production for the next 40+ years. He is the editor of all six editions of Printed Circuits Handbook.

Happy Holden is the director of electronics engineering and innovations at Gentex Corporation, and has worked in printed circuits in various capacities since 1970. Previously, he was a senior PCB technologist for Mentor Graphics' System Design Division, an advanced technology manager at Westwood Association and Merix Corp., and he worked for Hewlett-Packard for 28 years.

Table of Contents

Part I: Lead-Free Legislation
Ch. 1: Legislation and Impact on Printed Circuits
Part II: Managing the Printed Circuit Supply Chain
Ch. 2: Basics of Printed Circuit Supply Chain Management
Ch. 3: Design for A Manufacturer
Ch. 4: Managing Information, Documentation and Transfer
Ch. 5: Supplier Selection and Qualification
Ch. 6: Process Control, Monitoring and Incoming Inspection
Ch. 7: Product Acceptance and Feedback
Part III: Printed Circuits Technology Drivers
Ch. 8: Electronic Packaging and High Density Interconnectivity
Ch. 9: Component Packaging Technology
Ch. 10: Types of Printed Circuits
Part IV: Materials
Ch. 11: Introduction to Base Materials
Ch. 12: Base Material Components
Ch. 13: Properties of Base Materials
Ch. 14: Base Material Performance Issues
Ch. 15: The Impact Of Lead-Free Assembly On Base Materials
Ch. 16: Selecting Base Materials for Lead-Free Assembly Applications
Ch. 17: Laminate Qualification and Testing
Part V: Engineering and Design
Ch. 18: Physical Characteristics of the PCB
Ch. 19: The PCB Design Process
Ch. 20: Electrical and Mechanical Design Parameters
Ch. 21: Basics Of Printed Circuit and Layout
Ch. 22: Current Carrying Capacity in Printed Circuits
Ch. 23: PCB Design for Thermal Performance
Ch. 24: Planning For Design, Fabrication, and Assembly
Ch. 25: Manufacturing Information Documentation and Transfer Including CAM Tooling For Fabrication and Assembly
Part VI: High Density Interconnection
Ch. 26: High-Density Interconnection (HDI) Technologies
Ch. 27: Advanced High-Density Interconnection (HDI) Technologies
Part VII: Fabrication
Ch. 28: Drilling Processes
Ch. 29: Precision Interconnect Drilling
Ch. 30: Imaging
Ch. 31: Multilayer Materials and Processing
Ch. 32: Preparing Boards for Plating
Ch. 33: Electroplating
Ch. 34: Direct Plating
Ch. 35: Printed Circuit Board Surface Finishes
Ch. 36: Solder Mask
Ch. 37: Etching Process and Techniques
Ch. 38: Machining and RoutingPart VIII: Bare Board Test
Ch. 39: Bare Board Test Objectives and Definitions
Ch. 40: Bare Board Test Methods
Ch. 41: Bare Board Test Equipment
Ch. 42: HDI Bare Board Special Testing Methods
Part IX: Assembly
Ch. 43: Assembly Processes
Ch. 44: Conformal Coating
Part X: Soldering Materials and Processes
Ch. 45: Soldering: Incoming Inspection and Web Balance Technique
Ch. 46: Soldering Fundamentals
Ch. 47: Soldering Materials and Metallurgy
Ch. 48: Solder Fluxes
Ch. 49: Soldering Techniques
Ch. 50: Soldering Repair and Rework
Part XI: Non-solder Interconnection
Ch. 51: Press-Fit Interconnections
Ch. 52: Land Grid Array Interconnection
Part XII: Quality
Ch. 53: Acceptability and Quality of Fabricated Boards
Ch. 54: Acceptability and Quality of Printed Circuit Board Assemblies
Ch. 55: Assembly Inspection
Ch. 56: Design for Assembled Board Testing
Ch. 57: Assembly Testing
Part XIII: Reliability
Ch. 58: Conductive Anodic Filament Formation
Ch. 59: Reliability of Printed Circuit Assemblies
Ch. 60: Reliability of Printed Circuit Assemblies
Ch. 61: Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
Part IX: XIV Flexible Circuits
Ch. 62: Flexible Circuit Applications and Materials
Ch. 63: Design of Flexible Circuits
Ch. 64: Manufacturing of Flexible Circuits
Ch. 65: Termination of Flexible Circuits
Ch. 66: Multilayer Flex and Rigid/Flex
Ch. 67: Special Constructions of Flexible Circuits
Ch. 68: Quality Assurance of Flexible Circuits
Appendix: IPC Documents
Glossary
Index