Reliability Characterisation of Electrical and Electronic Systems

by Elsevier Science

Overview

This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices.

The text describes the reliability behavior of electrical and electronic systems. It takes an empirical scientific approach to reliability engineering to facilitate a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation. After introducing the fundamentals and background to reliability theory, the text moves on to describe the methods of reliability analysis and charactersation across a wide range of applications.

• Takes a holistic approach to reliability engineering
• Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability
• Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation

Product Details

ISBN-13:	9781782422259
Publisher:	Elsevier Science
Publication date:	12/24/2014
Series:	Woodhead Publishing Series in Electronic and Optical Materials
Sold by:	Barnes & Noble
Format:	eBook
Pages:	274
File size:	9 MB

About the Author

Jonathan Swingler is Senior Lecturer in Energy at Heriott-Watt University within the School of Engineering and Physical Sciences (Electrical Engineering). His work is primarily focused on electrical contacts and interconnecting in automotive and aerospace systems.

Table of Contents

• List of contributors
• Woodhead Publishing Series in Electronic and Optical Materials
• Foreword
• 1: Introduction
  • Abstract
  • 1.1 Introduction
  • 1.2 The focus of the book
  • 1.3 Reliability science and engineering fundamentals (Chapters 2–4)
  • 1.4 Reliability methods in component and system development (Chapters 5–9)
  • 1.5 Reliability modelling and testing in specific applications (Chapters 10 and 11)
  • 1.6 Conclusion
• 2: Reliability and stupidity: mistakes in reliability engineering and how to avoid them
  • Abstract
  • 2.1 Introduction
  • 2.2 Common mistakes in reliability engineering
  • 2.3 Conclusion
• 3: Physics-of-failure (PoF) methodology for electronic reliability
  • Abstract
  • 3.1 Introduction
  • 3.2 Reliability
  • 3.3 PoF models
  • 3.4 PoF reliability assessment
  • 3.5 Applications of PoF to ensure reliability
  • 3.6 Summary and areas of future interest
• 4: Modern instruments for characterizing degradation in electrical and electronic equipment
  • Abstract
  • 4.1 Introduction
  • 4.2 Destructive techniques
  • 4.3 Nondestructive techniques
  • 4.4 In situ measurement techniques
  • 4.5 Conclusions
• 5: Reliability building of discrete electronic components
  • Abstract
  • 5.1 Introduction
  • 5.2 Reliability building
  • 5.3 Failure risks and possible corrective actions
  • 5.4 Effect of electrostatic discharge on discrete electronic components
  • 5.5 Conclusions
• 6: Reliability of optoelectronics
  • Abstract
  • 6.1 Introduction
  • 6.2 Overview of optoelectronics reliability
  • 6.3 Approaches and recent developments
  • 6.4 Case study: reliability of buried heterostructure (BH) InP semiconductor lasers
  • 6.5 Reliability extrapolation and modeling
  • 6.6 Electrostatic discharge (ESD) and electrical overstress (EOS)
  • 6.7 Conclusions
• 7: Reliability of silicon integrated circuits
  • Abstract
  • Acknowledgments
  • 7.1 Introduction
  • 7.2 Reliability characterization approaches
  • 7.3 Integrated circuit (IC) wear-out failure mechanisms
  • 7.4 Summary and conclusions
• 8: Reliability of emerging nanodevices
  • Abstract
  • 8.1 Introduction to emerging nanodevices
  • 8.2 Material and architectural evolution of nanodevices
  • 8.3 Failure mechanisms in nanodevices
  • 8.4 Reliability challenges: opportunities and issues
  • 8.5 Summary and conclusions
• 9: Design considerations for reliable embedded systems
  • Abstract
  • 9.1 Introduction
  • 9.2 Hardware faults
  • 9.3 Reliable design principles
  • 9.4 Low-cost reliable design
  • 9.5 Future research directions
  • 9.6 Conclusions
• 10: Reliability approaches for automotive electronic systems
  • Abstract
  • Acknowledgment
  • 10.1 Introduction
  • 10.2 Circuit reliability challenges for the automotive industry
  • 10.3 Circuit reliability checking for the automotive industry
  • 10.4 Using advanced electronic design automation (EDA) tools
  • 10.5 Case studies and examples
  • 10.6 Conclusion
• 11: Reliability modeling and accelerated life testing for solar power generation systems
  • Abstract
  • 11.1 Introduction
  • 11.2 Overview
  • 11.3 Challenges
  • 11.4 Modeling
  • 11.5 Accelerated life testing (ALT)
  • 11.6 ALT example: how to craft a thermal cycling ALT plan for SnAgCu (SAC) solder failure mechanism
  • 11.7 How to craft a temperature, humidity, and bias ALT plan for CMOS metallization corrosion
  • 11.8 Developments and opportunities
  • 11.9 Conclusions
  • 11.10 Sources of further information
• Index

What People are Saying About This

From the Publisher

A holistic approach to reliability engineering for electrical and electronic systems, looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices

Editorial Reviews

"One chapter stands out in the book Reliability Characterization of Electrical and Electronic Systems, edited by Jonathan Swingler. That chapter is 'Reliability and Stupidity: Mistakes in Reliability Engineering and How to Avoid Them,"...Following are excerpts from that chapter." —Power Electronics

From the Publisher