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Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004, Author: S. Kakaï
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
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