Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
Title: Boundary-Scan Interconnect Diagnosis, Author: José T. de Sousa
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
Title: Manufacturing Challenges in Electronic Packaging, Author: Y.C. Lee
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Advanced Wirebond Interconnection Technology, Author: Shankara K. Prasad
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: The Basics of Soldering, Author: Armin Rahn
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens

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