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Title: Intelligent Systems: Technology and Applications, Six Volume Set, Author: Cornelius T. Leondes
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Intelligent Systems:…
by Cornelius T. Leondes (Editor)
eBook $2,770.00
Title: ENCYCLO THERMAL PACK SET 2 (4V): Set 2: Thermal Packaging Tools(A 4-Volume Set), Author: World Scientific Publishing Company
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ENCYCLO THERMAL PACK SET 2 (4V…
by World Scientific Publishing Company
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eBook $1,264.00
Title: ENCYCLO PACK MATER, PROCESS (4V): Set 1: Interconnect and Wafer Bonding Technology(In 4 Volumes)Volume 1: Flip-Chip and Underfill Materials and TechnologyVolume 2: Wire Bonding TechnologyVolume 3: Flexible Chip I/O InterconnectsVolume 4: Wafer Bonding Tec, Author: World Scientific Publishing Company
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ENCYCLO PACK MATER, PROCESS…
by World Scientific Publishing Company
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Title: ENCYCLO THERMAL PACK SET 3 (3V): Set 3: Thermal Packaging Applications(A 3-Volume Set), Author: Avram Bar-cohen
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ENCYCLO THERMAL PACK SET 3 (3V…
by Avram Bar-cohen (Editor)
#3 in Series
eBook $960.00
Title: Microscopy of Semiconducting Materials: 1999 Proceedings of the Institute of Physics Conference held 22-25 March 1999, University of Oxford, UK, Author: A.G Cullis
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Microscopy of Semiconducting…
by A.G Cullis (Editor), R Beanland (Editor)
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eBook $725.00
Title: HYBRID ORGAN INORGAN PEROVS (4V): Physical Properties and Applications(In 4 Volumes)Volume 1: Hybrid Organic Inorganic Perovskites: Physical PropertiesVolume 2: Hybrid Organic Inorganic Perovskites: Optical PropertiesVolume 3: Spin Response of Hybrid Orga, Author: World Scientific Publishing Company
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HYBRID ORGAN INORGAN PEROVS…
by World Scientific Publishing Company
#18 in Series
eBook $704.00
Title: Integrating Microelectronics into Gas Distribution, Author: W.F. Rush
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Integrating Microelectronics…
by W.F. Rush (Editor), J.E. Huebler (Editor), R.W. Smith (Editor)
eBook $700.00
Title: Microprobe Characterization of Optoelectronic Materials, Author: Juan Jimenez
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Microprobe Characterization of…
by Juan Jimenez
eBook $650.00
Title: CRC Handbook of Thermoelectrics, Author: D.M. Rowe
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CRC Handbook of…
by D.M. Rowe (Editor)
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Title: Strain and Temperature Measurement with Fiber Optic Sensors, Author: Regis J. Van Steenkiste
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Strain and Temperature…
by Regis J. Van Steenkiste
eBook $600.00
Title: Proceedings of the 44th Industrial Waste Conference May 1989, Purdue University, Author: John W. Bell
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Proceedings of the 44th…
by John W. Bell
eBook $575.00
Title: Software Architectures and Tools for Computer Aided Process Engineering, Author: Bertrand Braunschweig
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Software Architectures and…
by Bertrand Braunschweig (Editor), Rafiqul Gani (Editor)
#11 in Series
eBook $570.00
Title: Lead Chalcogenides: Physics and Applications, Author: D. Khokhlov
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by D. Khokhlov
eBook $550.00
Title: Electronic Structure, Author: K. Horn
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Electronic Structure
by K. Horn (Editor), M. Scheffler (Editor)
#2 in Series
eBook $550.00
Title: Photosensitive Polyimides: Fundamentals and Applications, Author: Takashi Yamashita
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by Takashi Yamashita
eBook $550.00
Title: Power Transmissions: Proceedings of the International Conference on Power Transmissions 2016 (ICPT 2016), Chongqing, P.R. China, 27-30 October 2016, Author: Datong Qin
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Power Transmissions:…
by Datong Qin (Editor)
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Title: Intelligent Robotic Systems, Author: Spyros G. Tzafestas
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Intelligent Robotic Systems
by Spyros G. Tzafestas
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eBook $550.00
Title: Bioinstrumentation and Biosensors, Author: Donald L. Wise
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Bioinstrumentation and…
by Donald L. Wise
eBook $550.00
Title: Handbook of Electronic Package Design, Author: Michael Pecht
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Handbook of Electronic Package…
by Michael Pecht
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eBook $550.00
Title: Deep Centers in Semiconductors, Author: Sokrates T. Pantelides
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Deep Centers in Semiconductors
by Sokrates T. Pantelides
eBook $550.00

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