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Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
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Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: Handbook of Electronic Package Design, Author: Michael Pecht
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
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Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg

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