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Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Hardcover $279.99
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
Explore Series
Paperback $86.99
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
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Lead-Free Soldering in…
by Katsuaki Suganuma
eBook $240.00
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
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CAE - CAD and Thermal…
by Dereje Agonafer (Editor)
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Paperback $72.00
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï (Editor), L.L. Vasiliev (Editor), Y. Bayazitoglu (Editor), Y. Yener (Editor)
#193 in Series
Hardcover $329.99
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
Explore Series
Hardcover $350.00
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï (Editor), L.L. Vasiliev (Editor), Y. Bayazitoglu (Editor), Y. Yener (Editor)
#193 in Series
Paperback $329.99
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones (Editor), Karel Kurzweil (Editor), Gábor Harsányi (Editor), Sylvia Mergui (Editor)
#2 in Series
Hardcover $219.99
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Hardcover $140.00
Title: Heat Transfer: Thermal Management of Electronics, Author: Younes Shabany
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Heat Transfer: Thermal…
by Younes Shabany
eBook $170.00
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects, Author: Michael G. Pecht
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Quality Conformance and…
by Michael G. Pecht (Editor), Abhijit Dasgupta (Editor), John W. Evans (Editor), Jillian Y. Evans (Editor)
Paperback $188.95
Title: Run-to-Run Control in Semiconductor Manufacturing, Author: James Moyne
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Run-to-Run Control in…
by James Moyne (Editor), Enrique del Castillo (Editor), Arnon M. Hurwitz (Editor)
eBook $230.00
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
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eBook $210.00
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Paperback $279.99
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
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Hardcover $218.95
Title: Advanced Wirebond Interconnection Technology, Author: Shankara K. Prasad
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Advanced Wirebond…
by Shankara K. Prasad
Other Format $329.99
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim (Editor), Sang Woo Lee (Editor)
eBook $82.99
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
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LED Packaging for Lighting…
by Shen Liu, Xiaobing Luo
eBook $144.00
Title: Chip On Board: Technology for Multichip Modules, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
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Hardcover $219.99

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