Interfacial Science in Ceramic Joining / Edition 1

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Overview

A unique combination of the basic science and fundamental aspects of joints and interfaces with the engineering aspects of the subject. Contributors include researchers drawn from several Eastern European countries.
Topics addressed include processing, interfacial reactions, graded joints, residual stress measurement and analysis, and failure and deformation.
Audience: Academic and industrial researchers and ceramic manufacturers interested in understanding the current state of the art in joining.

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Editorial Reviews

Booknews
The 40 contributions from the November 1997 workshop present developments and new research results in the joining of dissimilar materials and interfaces as related to ceramics. The discussions focus on the control and understanding of microstructures and interfaces, and new challenges in the processing and characterization of materials. The subjects of the sessions are wettability and related phenomena; joining techniques such as brazing, and diffusion bonding; interfacial phenomena including diffusion processing, phase formation, and microstructural characteristics of interfaces; relationships between interface properties, adhesion and mechanical properties of joints; and ceramic interfaces in electronic applications. Example topics are the vibrational spectroscopic study of surfaces and thin layers, dissipation analysis of interface failure of bimaterials, and the influence of boundaries on ionic conductors. Annotation c. by Book News, Inc., Portland, Or.
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Product Details

  • ISBN-13: 9789048150861
  • Publisher: Springer-Verlag New York, LLC
  • Publication date: 12/6/2010
  • Series: Nato Science Partnership Subseries: 3 (closed) , #58
  • Edition description: Softcover reprint of hardcover 1st ed. 1998
  • Edition number: 1
  • Pages: 494
  • Product dimensions: 6.14 (w) x 9.21 (h) x 1.00 (d)

Table of Contents

Preface
List of Participants
Structure, Composition and Thermal Stability of the Cu/Al[subscript 2]O[subscript 3] Interface 3
Diffusion Bonding of Si[subscript 3]N[subscript 4]-Ceramic to Transition Metals: Interfacial Microchemistry 15
Improvement of Wetting and Bonding of Dissimilar Materials 27
Wetting and Interfaces in Metal-Oxide Systems: Sensitivity to Experimental Conditions 45
Kinetics of Spreading of Some Metal Melts over Covalent Ceramic Surfaces 57
Chemical Interaction at the Initial Stage of Spreading 69
Wettability Under Non-Reactive and Reactive Conditions in the Systems Ni/YSZ and Ni/Ti-TiO[subscript 2]/YSZ 79
Wettability of TiB[subscript 2] Ceramics by Liquid Cu and Ag-Cu Eutectic Alloys 87
The Brazing of Ceramics: Material Science Aspect of Reactive Braze Alloys 97
Transient Liquid Phase (TLP) Routes to the Joining of Structural Ceramics 111
Joining of Si[subscript 3]N[subscript 4] Using Al and Ni Interlayers 135
Metallic Reaction for Joining of SiC Ceramics 143
Alumina-Aluminium Interfaces 153
Diffusion Processes at Liquid Metal/Ceramic Interfaces 161
Role of Interfacial and Strain Energy for the Formation of Native Metal-Oxide Interfaces 169
Phase Formation at Metal-Ceramic Interfaces 183
TEM Examinations of B[subscript 13]O[subscript 2]/Al Reaction Zone 195
Interfacial Reaction Kinetics of Silicon Nitride/Iron Alloys Diffusion Couples in the Range 1050[degrees]C/1250[degrees]C 203
The Role of Intergranular Phases in Silicon Nitride and Silicon Carbide Direct Joining 211
Interdiffusion at Metal/Oxide Interfaces Studied in Thin-Film Structures with AES Depth Profiling 223
FT-IR and FT-Raman Study of Surfaces and Thin Layers 233
Interfaces and Structural Integrity of Ceramic/Metal Joints: Reliability of Interface 249
Fracture Criteria for Interface Cracks. A Case Study 267
Interfaces in High-Strength, High-Temperature Ceramic Joints 281
Dissipation Analysis of Interface Failure of Bimaterials 295
Calculation and Experimental Determination of the Residual Stresses in a Metal-Ceramic Bond 311
Application of the Blister Test to Adhesion Energy Measurements in Metal/Ceramic Film-on-Substrate Systems 319
Microstructure, Mechanical Properties and Stability of Brazed Metal/Ceramic Systems: Technological Aspects and Testing Methodologies 329
Joining of Silicon Nitride Ceramics to Titanium Alloy with an Interlayer 341
Layered Composites - Relationship Between Residual Stresses and Fracture Behaviour 349
Adhesion in Steel/Silicate Glass System 357
Reactive Coatings on Ceramic Substrates 367
Fabrication of Metal/Oxide Ceramic Functionally Graded Materials by Slip Casting 383
The Joining of Alumina Membranes 399
Joining Ceramics Using Preceramic Polymers 405
The Importance of the Ceramic Interface in Electronic Applications 417
Interaction of MLC BaTiO[subscript 3] Based Ceramic with Silver Termination Ink 429
Influence of Boundaries on Ionic Conductance 443
Interface Effects in Ferroelectric Thin Films 457
Characterisation of the Metal-Ceramic Direct Soldering by the Metal-Metal Diffusion Method 465
Author Index 473
Subject Index 477
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