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3D Integration for VLSI Systems

By Chuan Seng Tan (Editor), Kuan-Neng Chen (Editor), Steven J. Koester (Editor)
eBook
$160.00
By Chuan Seng Tan (Editor), Kuan-Neng Chen (Editor), Steven J. Koester (Editor)
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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

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