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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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$84.99
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
- Describes how to use the developed methods of analytical predictive modeling to minimize thermal stre...
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