Semiconductor Machinery in Japan

The Semiconductor Machinery Japan eBook provides 14 years Historic and Forecast data on the market for each of the 36 Products / Services covered. The Products / Services covered (Semiconductor machinery) are classified by the 5-Digit NAICS Product Codes and each Product and Services is then further defined and analysed by each 6 to 10-Digit NAICS Product Codes. In addition full Financial Data (188 items: Historic and Forecast Balance Sheet, Financial Margins and Ratios) Data is provided, as well as Industry Data (59 items) for Japan.

There are 36 Products/Services covered, including:

SEMICONDUCTOR MACHINERY

1. Semiconductor machinery mfg
2. Semiconductor manufacturing equipment (except furnaces & ovens, instruments & photographics)
3. Semiconductor wafer processing equipment, thin layer chemical vapor deposition
4. Semiconductor wafer processing equipment, thin layer physical vapor deposition
5. Semiconductor wafer processing equipment, plasma etch
6. Other semiconductor equipment
7. Microlithography, incl aligners & other lithography systems
8. Semiconductor wafer processing equipment, thin layer epitaxial growth deposition
9. Semiconductor wafer processing equipment, wet etch
10. Semiconductor wafer processing equipment, reactive ion etch
11. Semiconductor wafer process. equip., reactive ion etch/etc.
12. Semiconductor wafer processing equipment, stripping systems
13. Ion implantation incl current & voltage ion implanters
14. Wafer processing equipment to saw (slice) blank wafers from crystal boules
15. Wafer processing equipment designed to grind or polish semiconductor wafers
16. Wafer processing equipment, pattern generating apparatus to produce masks & reticles from photoresist coated substrates, except focused ion beam milling machines
17. Other semiconductor wafer processing equipment
18. Semiconductor assembly dicing machines, incl saws & scribing-fracturing machines
19. Semiconductor assembly dicing machines
20. Semiconductor assembly die bonders
21. Semiconductor assembly wire bonders
22. Other parts & packaging of semiconductor manufacturing machinery
23. Packaging, incl mold & seal equipment & finish & mark equipment
24. Other assembly & packaging equipment, incl lead frame inserting machines
25. Parts of machine tools designed to produce or process semiconductor wafers
26. Parts of ion beam & plasma machines designed to process semiconductor wafers & designs by removal of material
27. Parts of ion implanters designed for doping semiconductor wafers
28. Parts of apparatus for the projection of circuit patterns on sensitized semiconductor materials
29. Parts of pattern generating apparatus designed to produce masks & reticles from photoresist coated substrates
30. Other parts of semiconductor manufacturing machinery
31. Printed circuit board manufacturing machinery, except testing, nsk
32. Semiconductor manufacturing machinery, nec, nsk, nonadministrative-record
33. Semiconductor manufacturing machinery, nec, nsk, administrative-record

There are 188 Financial items covered, including:
Total Sales, Pre-tax Profit, Interest Paid, Non-trading Income, Operating Profit, Depreciation, Trading Profit, Intangible Assets, Intermediate Assets, Fixed Assets (Structures, P + E, Misc.), Capital Expenditure (Structures, P + E, Vehicles, IT, Misc.), Retirements (Structures, P + E, Misc.), Total Fixed Assets, Stocks (Finished Product, Work in Progress, Materials), Total Stocks / Inventory, Debtors, Total Maintenance Costs, Services Purchased, Misc. Current Assets, Total Current Assets, Total Assets, Creditors, Short Term Loans, Misc. Current Liabilities, Total Current Liabilities, Net Assets / Capital Employed, Shareholders Funds, Long Term Loans, Misc. Long Term Liabilities, Workers, Hours Worked, Total Employees, Costs (Raw Materials, Finished Materials, Fuel, Electricity), Total Input Supplies / Materials + Energy Costs, Payroll, Wages, Director Remunerations, Employee Benefits, Commissions, Total Employees Remunerations, Sub Contractors, Rental & Leasing (Structures, P + E), Total Rental & Leasing Costs, Maintenance (Structures, P + E), Communications Costs, Misc. Expenses, Sales Personnel Costs, Sales Expenses, Sales Materials, Total Sales Costs, Distribution (Fixed + Variable Costs), Premises (Fixed + Variable Costs), Physical Handling (Fixed + Variable Costs), Physical Process (Fixed + Variable Costs), Total Distribution Costs, Correspondence Costs, Advertising (Media, Materials, POS & Display Costs, Events Costs), Total Advertising Costs, Product (Handling, Support, Service Costs), Customer Costs, Total After-Sales Costs, Total Marketing Costs, New Technology + New Production Technology Expenditure, Research + Development Expenditure, Operational & Process Costs, Debtors + Debts.
/.. etc.

Semiconductor Machinery in Japan