ISBN-10:
1441907831
ISBN-13:
9781441907837
Pub. Date:
12/10/2009
Publisher:
Springer US
Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures / Edition 1

Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures / Edition 1

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Product Details

ISBN-13: 9781441907837
Publisher: Springer US
Publication date: 12/10/2009
Series: Integrated Circuits and Systems
Edition description: 2010
Pages: 284
Product dimensions: 6.40(w) x 9.30(h) x 0.90(d)

Table of Contents

Introduction.- 3D Process Technology Considerations.- Thermal and Power Delivery Challenges in 3D Integrated Circuits.- Thermal-Aware 3D Floorplan.- Thermal-Aware 3D Placement.- Thermal Via Insertion and Thermally-aware Routing in 3D ICs.- 3D Microprocessor Design.- 3D Network-on-chip Architecture.- PicoServer: Using 3D Stacking Technology To Build Energy Efficient Servers.- System Level 3D IC Cost Analysis and Design Exploration.

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