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3D Microelectronic Packaging: From Architectures to Applications

By Yan Li (Editor), Deepak Goyal (Editor)
Hardcover
$199.99
By Yan Li (Editor), Deepak Goyal (Editor)
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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fau...

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EngineeringElectrical & Electronic EngineeringElectronics - Circuits - GeneralElectronic circuits