Book Haul is Back! 50% Off Hundreds of Hardcovers And More Deals Shop Now In Stores & OnlineBook Haul is Back! 50% Off Hundreds of Hardcovers And More Deals Shop Now In Stores & Online
Add Item to wish listAdd Item to wish list
Read sample

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

By Ephraim Suhir
Paperback
$84.99
By Ephraim Suhir
Promotion message icon

Premium Members save an extra 10% and all Members collect stamps to save with Rewards. 10 stamps = $5. Learn More

Formats
See All Formats & Editions
In stock
This item is currently out of stock online.
Free standard shipping on orders over $60
Select a store to view item availability.

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

  • Describes how to use the developed methods of analytical predictive modeling to minimize thermal str...

Categories

Science & TechnologyEngineeringElectrical & Electronic EngineeringPhysicsElectromagnetismEngineering - Electrical & ElectronicElectromagnetism - General & Miscellaneous