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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package

By Beth Keser (Editor), Steffen Krhnert (Editor)
eBook
$124.00
By Beth Keser (Editor), Steffen Krhnert (Editor)
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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies

In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches.

The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to...

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Science & TechnologyEngineeringElectrical & Electronic EngineeringElectronics - Microelectronics