ENCYCLO PACK MATER, PROCESS (4V): Set 1: Interconnect and Wafer Bonding Technology(In 4 Volumes)Volume 1: Flip-Chip and Underfill Materials and TechnologyVolume 2: Wire Bonding TechnologyVolume 3: Flexible Chip I/O InterconnectsVolume 4: Wafer Bonding Tec

Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully ba...