Interconnect Reliability in Advanced Memory Device Packaging

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.

In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as rel...