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Materials for Advanced Packaging

By Daniel Lu (Editor), C.P. Wong (Editor)
Paperback
$249.99
By Daniel Lu (Editor), C.P. Wong (Editor)
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This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfill...

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Science & TechnologyEngineeringElectrical & Electronic EngineeringElectronics - General & Miscellaneous