Pub. Date:
Springer US
RF and Microwave Microelectronics Packaging / Edition 1

RF and Microwave Microelectronics Packaging / Edition 1


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RF and Microwave Microelectronics Packaging / Edition 1

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Product Details

ISBN-13: 9781441909831
Publisher: Springer US
Publication date: 11/17/2009
Edition description: 2010
Pages: 285
Product dimensions: 1.70(w) x 2.40(h) x 0.70(d)

Table of Contents

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.

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RF and Microwave Microelectronics Packaging 5 out of 5 based on 0 ratings. 1 reviews.
Anonymous More than 1 year ago
This book summarizes the latest development in RF/MW packaging. This is a very useful reference book for both scientists and engineers working in high frequency packaging. Highly recommended.