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Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-2

By Lawrence L. Rosine
Paperback
$54.99
By Lawrence L. Rosine
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EngineeringElectrical & Electronic EngineeringElectronics - Circuits - GeneralElectronic circuits