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Electronics Packaging Forum: Volume Two

By James E. Morris
Paperback
$54.99
By James E. Morris
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Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 pr...

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Science & TechnologyEngineeringElectrical & Electronic EngineeringElectronic Packaging