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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004

By R. J. Carter (Editor), C. S. Hau-Riege (Editor), G. m. Kloster (Editor), T. -M. Lu (Editor), S. E. Schulz (Editor)
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$39.00
By R. J. Carter (Editor), C. S. Hau-Riege (Editor), G. m. Kloster (Editor), T. -M. Lu (Editor), S. E. Schulz (Editor)
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The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of th...

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