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More-than-Moore 2.5D and 3D SiP Integration

By Riko Radojcic
Paperback
$99.99
By Riko Radojcic
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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs ...

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Science & TechnologyComputersEngineeringElectrical & Electronic EngineeringComputers - General & MiscellaneousElectronics - Circuits - GeneralComputer Architecture/EngineeringElectronic circuits