Premium & Rewards Members 25% Off Pre-Order Books With Code PREORDER25 Ends 6/26 Shop Now Online only. See page for details.Premium & Rewards Members 25% Off Pre-Order Books With Code PREORDER25 Ends 6/26 Shop Now Online only. See page for details.
Add Item to wish listAdd Item to wish list

RF and Microwave Microelectronics Packaging

By Ken Kuang (Editor), Franklin Kim (Editor), Sean S. Cahill (Editor)
Paperback
$169.99
By Ken Kuang (Editor), Franklin Kim (Editor), Sean S. Cahill (Editor)
Promotion message icon
Premium Members save an extra 10% and all Members collect stamps to save with Rewards. 10 stamps = $5.Learn More
Formats
See All Formats & Editions
In stock
This item is currently out of stock online.
Free standard shipping on orders over $60
Select a store to view item availability.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW ...

Categories

Science & TechnologyEngineeringElectrical & Electronic EngineeringElectronics - General & MiscellaneousElectronics - Microelectronics