Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges.

It's important to be able understand and predict the thermomechanical reliability of advanced electronic packaging. Traditional trial-and-error approaches are time-consuming, expensive, and often unable to capture the intricacies of real-world operating conditions. Numerica...